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STIC's STMicroelectronics (ST; NYSE: STM), the world's leading semiconductor supplier, has announced that its latest antenna tuning circuit, the STHVDAC-253M, has been adopted by a major Asian mobile phone manufacturer. Smart antenna tuning for controlling new LTE smartphones.
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The smart antenna tuning chip minimizes the sensitivity of RF signal transceiving to the external environment, providing end users with many benefits, including stronger RF signals, fewer calls dropped, faster data rates, and Longer battery life. The antenna tuning function uses the fixed inductance of the built-in antenna of the mobile phone and the digitally controlled capacitor to match the antenna frequency. The antenna tuning circuit can accurately control the adjustable capacitor (such as the STPTIC series of STMicroelectronics) to perfectly match the antenna resonant frequency and the occupied frequency band.
The STHVDAC-253M is a dedicated ASIC chip that integrates three high-voltage digital-to-analog converters to optimize antenna performance simultaneously in three different frequency bands. ST's smart tuner uses the recently released MIPI RFFE [1] standard design interface. Mobile communication chipset manufacturers use the RFFE standard for interface technologies for RF modules and various front-end modules, such as power amplifiers, low noise amplifiers, filters, switches, DC-DC converters, and antennas.
While the mobile device market is highly sensitive to product prices, device vendors must continually improve the user experience. By bringing antenna performance to a new level of customer satisfaction, ST's solutions have enabled LTE smartphone manufacturers to dramatically improve the user experience.
Prior to the development and use of the RFFE standard, the SPI (Serial Peripheral Interface) was an industry standard control interface. At that time, the customer had to modify the driver circuit to support the antenna tuning circuit. The STHVDAC-253M supports all the features of the MIPI RFFE standard, such as extended mode, flip-flops and 26MHz clock generation, while the chip package size is 30% smaller than other vendors' solutions, bringing many benefits to handset manufacturers in terms of cost and board size. .
Ricardo De Sa-Earp, vice president and general manager of ASD and IPAD products at STMicroelectronics, said: "By providing solutions that directly benefit end users, we have helped many device manufacturers achieve market success. Our latest antenna tuning circuit is just One of the examples, the customer's latest product is the best proof."
The STHVDAC-253M sample is available in a Flip Chip CSP 0.4mm pitch package and is available now.
[1] MIPI RF front-end technical specifications. The MIPI® Alliance was launched in 2003 by ARM, Intel, Nokia, Samsung, STMicroelectronics and Texas Instruments to develop an open membership organization for interface specifications for the mobile and mobile related industries. By 2013, there were more than 220 member companies worldwide.
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